Technology Engineering Patent Expert Witness Rolf Biernath

Rolf Biernath, PhD, has over 35 years of experience in the Chemical Industry with a concentration on Polymer Science and Engineering and Material Science Fracture Mechanics. He worked in Materials and Processes at 3M for 31 years, in senior technical roles developing materials, processes, and systems. His 57 issued US patents span a broad range of scientific and engineering disciplines.

Litigation Support - Dr. Biernath is a Patent & Civil Liability Expert Witness having worked with in-house and outside attorneys in prior art searches. He's drafted claims and strategized claims in a variety of fields. He has written Expert Reports for a Civil Liability, including material failure analysis, computer simulation, and manufacturing assessment.  He is known for his ability to explain complex technical problems simply.

Areas of Expertise:

Background Experience - Dr. Biernath has 57 Issued US Patents on New Products, including:

• Industrial Adhesives and Tapes – 3D printing materials development, automation, and tape application processes
• Electronic Materials – epoxy thermoset adhesives & application process (elastomeric epoxy), high speed electronic connectors
• Electronic Displays – optical display films, outdoor digital displays
• Microreplication – textured adhesives and processes, microfluidics, e-Paper
• Signage – retroreflective signage, license plate recognition, ADAS, Human Invisible, Machine-Readable Coding System
• IoT and IIoT – Automatic and predictive selection and replacement

Dr. Biernath has expertise in stresses in planar systems due to a range of causes including, thermal expansion mismatch, humidity and solvent uptake or loss, and cure shrinkage. He understands assembly processes for tapes and adhesives including interpreting Technical Data Sheets, Application Data Sheets, developing test methods, and selecting materials. Doctorate in Chemical Engineering focused on stresses in bonded planar layers, stress measurement, physical property modeling and stress modeling due to thermal, cure, solvent and other causes.

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